CORE-8550JD4 QCS8550 AI SoM

CORE-8550JD4 QCS8550 AI SoM

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CORE-8550JD4 AI SoM

Powered by the Qualcomm QCS8550 AI processor with a 48 TOPS NPU, it supports mainstream AI models and features the Adreno 740 GPU for ray tracing and 8K video. The cognitive ISP supports up to a 100MP single or triple 36MP camera, all in a compact design with a 260-pin gold finger interface.

Al Processor QCS8550

Features an hexa-core Kryo CPU in the QCS8550, powered by the ARM architecture with a clock speed of up to 3.36 GHz, delivering robust support for high-performance computing and multitasking.

Private Deployment

Supports private deployment of large-scale Transformer models (including Qwen, Llama, Gemma, DeepSeek-R1, and Phi series) and mainstream deep learning frameworks like TensorFlow, PyTorch, and ONNX.

Ray Tracing Technology

Equipped with the Adreno 740 GPU, it delivers full ray tracing support and is compatible with OpenGL ES 3.2, Vulkan 1.2, and OpenCL 3.0. Combined with Hexagon Neural Processing, it significantly boosts both graphics and AI computing performance.

8K Video Codec

Supports advanced video processing with 8K@60fps/4K@240fps decoding and 8K@30fps/4K@120fps encoding, delivering exceptionally detailed and smooth ultra-high-definition visuals.

36MP Triple Camera

Equipped with the Qualcomm Spectra Cognitive ISP featuring triple 18-bit ISPs and 2x DPHY 1.2/CPHY 2.0 interfaces, it supports flexible camera configurations up to a triple 36MP, dual 64MP+36MP, or a single 108MP setup for multi-stream vision systems.

4nm Low-Power Design

Built on a 4nm process for high efficiency and stable performance, it is ideal for always-on devices. With hardware interface compatibility to NVIDIA Jetson Orin NX/Nano, it enables rapid hardware platform iteration.

Gold-Finger Package

Features a compact 69.6mm × 48mm form factor with a standard 260-pin gold finger SODIMM interface, weighing just 22g for easy installation and broad compatibility across diverse device scenarios.

Development Toolchain

A comprehensive suite is provided—including an AI model optimization tool, video processing SDK, and reference design with full documentation—to enable efficient secondary development and accelerate the creation of proprietary products.

48 TOPS NPU Computing Power

Integrated 48 TOPS NPU supports mixed-precision computation (INT4 to FP16), enabling powerful edge AI capabilities such as intelligent data processing, voice recognition, and image analysis for most terminal devices.

Application Scenarios

Widely used in industries such as robotics, smart cameras, drones, edge computing, intelligent security, and smart home.

Robots

Smart Camera

Drone

Edge Computing

Intelligent Security

Smart Home

Interfaces

Specifications

CORE-8550JD4
Basic Specifications	SOC	Qualcomm QCS8550
	CPU	Qualcomm Kryo® CPU: Hexa-core 64-bit (1×GoldPlus@3.2GHz + 2×Gold@2.8GHz + 3×Silver@2.0GHz), 4nm advanced process, maximum frequency up to 3.36GHz
	GPU	Adreno 740 GPU: Supports ray tracing technology, OpenGL ES 3.2, Vulkan 1.2, full-profile OpenCL 3.0, and Adreno NN Direct
	ISP	Equipped with Qualcomm Spectra Cognitive ISP (Image Signal Processor), featuring three 18-bit 36MP ISPs
	NPU	Dual eNPU V3: Equipped with 4 HVX (Hexagon Vector Extensions), 1 HMX (Hexagon Matrix Extension); Computing power up to 48 TOPS (INT8), 12TOPS (FP16)
	Video decoding	8K@60fps/4K@240fps H.265/H.264/VP9/AV1
	Codec	Video decoding: 8K@60fps/4K@240fps H.264/VP9/AV1 Video encoding: 8K@30fps/4K@120fps H.264 Supports concurrent 4K@60fps decoding and 4K@60fps encoding for wireless display scenarios
	RAM	16GB LPDDR5X
	Storage	256GB UFS4.0
	OS	Ubuntu, Android, Yocto Linux Software Stack
	Software support	Supports on-premises deployment of large-scale parameter models based on the Transformer architecture, such as large language models (LLMs) including the Deepseek-R1 series, Gemma series, Llama series, Qwen series, Phi series, etc. Supports the QNN AI inference framework, as well as various deep learning frameworks including TensorFlow, TensorFlow Lite, PyTorch, ONNX, etc.
	Power	5V (voltage tolerance ±5%)
	Power consumption	Normal: 3W(5V/600mA), Max: 10W(5V/2000mA), Min(Sleep): 0.35W(5V/70mA)
	Interface type	SODIMM (260PIN, 0.5mm pitch)
	Dimension	69.6mm × 48.06mm × 5.1mm
	Weight	≈22g
	Environment	Operating Temperature: -20℃～60℃, Storage Temperature: -20℃～70℃, Operating Humidity: 10%～90%RH (No condensation)
Interface Specifications	Ethernet	Supports 2×Gigabit Ethernet (via PCIe expansion; onboard Ethernet PHY chip on core board); 5G/4G expandable
	Video input	2 × MIPI D/C PHY (4 lanes DPHY or 3 trios CPHY) + 2 × MIPI D/C PHY (2 lanes DPHY or 1 trio CPHY) Supports 36MP triple camera / 64MP + 36MP dual camera / 108MP single camera
	Video output	1 × HDMI2.0 (4K@60Hz), 1 × DP1.4 (via Type-C output)
	Audio input	2 × MIPI D/C PHY (4 lanes DPHY or 3 trios CPHY) + 2 × MIPI D/C PHY (2 lanes DPHY or 1 trio CPHY) Supports 36MP triple camera / 64MP + 36MP dual camera / 108MP single camera
	Audio output	2 × I2S (2 data channels per channel; supports 4-channel TX/RX, TDM/PCM modes, 48kHz sampling rate)
	PCIe	1 × PCIe3.0 (2lanes), 1 × PCIe4.0 (2lanes)
	USB	1 × USB3.1 Gen2 DRD with DP, 2 × USB3.0 HOST (via PCIe expansion)
	Other interfaces	3 × CCI I2C, 2 × I3C/I2C, 2 × SPI, 4 × UART, 1 × ADC, 1 × SDMMC, GPIOs