CORE-8550L

CORE-8550L

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CORE-8550L
  • CORE-8550L
  • CORE-8550L
  • CORE-8550L
  • CORE-8550L
  • CORE-8550L
  • CORE-8550L
CORE-8550L

CORE-8550L

$0.00
$0.00
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QCS8550 system on module with hardware AI acceleration and multimedia processing for custom embedded systems and edge AI.
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CORE-8550L System on Module

CORE-8550L System on Module

The CORE-8550L is powered by the Qualcomm QCS8550 six-core 64-bit AI processor, built on a 4nm process with clock speeds of up to 3.36GHz. Its Hexagon NPU delivers 48 TOPS of AI performance and supports mainstream AI models and deep learning frameworks. The integrated Adreno 740 GPU supports ray tracing, while a dedicated VPU enables 8K video encoding and decoding. The Spectra Cognitive ISP supports three concurrent 36MP cameras. With PCIe 4.0/3.0, USB 3.1 and native Ubuntu support.

CORE-8550L
48 TOPS for On-Device AI

48 TOPS for On-Device AI

Dual eNPU V3 Hexagon NPUs deliver a combined 48 TOPS of INT8 performance, supporting local deployment of large Transformer-based models, including Gemma, Llama, Qwen and Phi. Built around the QNN inference engine, the platform supports PyTorch, TensorFlow and ONNX models, providing hardware acceleration for on-device AI inference.

Comprehensive Development Toolchain

Comprehensive Development Toolchain

With native Ubuntu support, the platform provides Qualcomm AI Engine and QNN AI inference framework support, alongside a complete SDK, drivers and sample code. The toolchain covers model conversion, quantization and deployment, helping simplify edge AI application development and shorten debugging cycles.

Extensive AIoT Expansion Interfaces

Extensive AIoT Expansion Interfaces

The module provides eight MIPI-CSI interfaces, supporting simultaneous capture from three 36MP cameras or a dual-camera configuration of 64MP + 36MP. PCIe 4.0, PCIe 3.0 and USB 3.1 provide high-speed connectivity. Sixteen QUPv3 interfaces can be flexibly configured as UART, SPI or I2C, meeting peripheral connectivity requirements for industrial control, robotics, intelligent security and other edge applications.

Application Scenarios

Suitable for edge computing, private deployment of large AI models, robotics, intelligent security, compute services, industrial control computers, UAVs, intelligent IP cameras and related embedded products.

Edge Computing
Edge Computing
Large Model Localization
Large Model Localization
Robots
Robots
Intelligent Security
Intelligent Security
Industrial Control Host
Industrial Control Host
Drone
Drone

Interfaces

Interfaces

Specifications

CORE-8550L
Basic Specifications SOC

Qualcomm QCS8550
CPU

Qualcomm Kryo® CPU: Hexa-core 64-bit (1×GoldPlus@3.2GHz + 2×Gold@2.8GHz + 3×Silver@2.0GHz), 4nm advanced process, maximum frequency up to 3.36GHz
GPU

Adreno 740 GPU: Supports ray tracing technology, OpenGL ES 3.2, Vulkan 1.2, full-profile OpenCL 3.0, and Adreno NN Direct
ISP

Equipped with Qualcomm Spectra Cognitive ISP (Image Signal Processor), featuring three 18-bit 36MP ISPs
NPU

Dual eNPU V3: Equipped with 4 HVX (Hexagon Vector Extensions), 1 HMX (Hexagon Matrix Extension); Computing power up to 48TOPS (INT8), 12TOPS (FP16)
Codec

Video decoding: 8K@60fps/4K@240fps H.264/VP9/AV1

Video encoding: 8K@30fps/4K@120fps H.264

Supports concurrent 4K@60fps decoding and 4K@60fps encoding for wireless display scenarios
RAM

16GB LPDDR5X
Storage

256GB UFS4.0
OS

Ubuntu
Software support

Supports on-premises deployment of large-scale parameter models based on the Transformer architecture, such as large language models (LLMs) including the Deepseek-R1 series, Gemma series, Llama series, Qwen series, Phi series, etc.

Supports the QNN AI inference framework, as well as various deep learning frameworks including TensorFlow, TensorFlow Lite, PyTorch, Keras, PaddlePaddle, JAX, etc.
Power

DC 3.8V (Supports 3.5V~4.4V wide voltage input)
Power consumption

Normal: 2.66W(3.8V/700mA), Max: 10.26W(3.8V/2700mA), Min(Sleep): 0.114W(3.8V/30mA)
Interface type

LGA package, total 532-Pin, 14-layer PCB design; Pad size: 1mm × 0.6mm; Module flatness control: 0.15mm
Dimension

41.99mm × 40.0mm × 2.6mm
Weight

≈7g
Environment

Operating Temperature: -20℃～60℃, Storage Temperature: -20℃～70℃, Operating Humidity: 10%～90%RH (No condensation)
Interface Specifications Internet

Ethernet, Wi-Fi / Bluetooth expandable via PCIe and USB interfaces
Video input

6 × MIPI-CSI D/C PHY (4 lanes DPHY or 3 trios CPHY) + 2 × MIPI-CSI D/C PHY (2 lanes DPHY or 1 trio CPHY)

Supports 36MP triple camera / 64MP + 36MP dual camera / 108MP single camera
Video output

2 × MIPI-DSI (D-PHY 1.2 or C-PHY 1.2, 4 lanes, max resolution 4K@60Hz)
Audio
2 × SoundWire, 4 × DMIC, 6 × I2S (each channel includes 2 data lanes, supporting full-duplex stereo or up to 4-channel transmit/receive applications), 1 × I2S (supports 4 data lanes, enabling up to 8-channel transmit/receive applications)
PCIe

1 × PCIe3.0 (2lanes), 1 × PCIe4.0 (2lanes)
USB

1 × USB3.1 Gen2 DRD
Other interfaces

16 × QUPv3 Bus (QUPv3 can be flexibly configured as UART, SPI or I2C. Signals are multiplexed and cannot be used simultaneously; allocate resources according to practical application)